150g 1.7w/km Industry Adhesive Silicone Material Thermal glue
Syringe design for easy operation.
Helps disperse the heat from CPU to heatsink effectively.
Suitable for CPU heatsink or chip.
High temperature resistance.
Non-toxic, tasteless, non-corrosive.
Primary use: Thermal coupling of electrical / electronic devices to
Special properties: High conductivity; low bleed; stable at high
Glue weight: 150KG
Thermal conductivity: >1.829W/m-k
Thermal resistance: <0.123°C-in2/W
1 : 150g white Thermal glue
Dielectric Constant >5.1
Thermal Conductivity >1.7W/m-K
Viscosity no run
Thermal Impedance <0.105℃-in2/W
Thixotropic Index 380±10
Specific Gravity >2.5
Operation Temperture -30~300℃
Silicone Compounds 45%
Carbon Compounds 35%
Shenzhen Bo Yong Xin Electronics Co., Ltd. was established in 2010,
is a in one of the thermal conductivity’s material manufacturer in
development, production and sales. The company is based
on the thermal conductivity materials industry, and engaged in
researching and developing for many years’ production technology.
We advocate that innovation is the driving force continuation of
life, and quality is the assurance continuation of life. The future
of the company will aggressively pursue technological innovation
and quality improvement in the existing basis that the company
later developed roots.
If you have any questions, please feel free to contact me, Thank
ShenZhen Bonyx Electronic Co.,ltd
Tel:0086-0755-28364930 /28609509 /28602015
Add:The 2th floor.Town 19-1.AnYe Road 8th An Lian village HengGang